With the rapid development of AI computing and high-density servers, traditional air cooling can no longer meet the thermal requirements of CPUs and GPUs. Liquid cold plates have emerged as a front-line solution, offering direct chip-level cooling for high-performance servers.
Server Chip-Level Liquid Cooling
High-power server modules generate concentrated heat that air-cooled solutions struggle to dissipate. By installing water cooled cold plates directly onto chips, including CPU Water Blocks, FSW Liquid Cold Plates, Tube Liquid Cold Plates, and Brazed Liquid Cold Plates, heat can be efficiently removed at the source.
The integration of water cooling plates, cold plate electronics cooling, and cooling plates for electronics allows servers to maintain optimal operating temperatures even under high computational loads. Small cold plates, standard cold plates, and tube cold plates provide flexibility for various server architectures, while cold plate design and cold plate cooling technologies ensure uniform temperature distribution across high-power modules.
Moreover, water cooling circuits and advanced water cooling technology optimize the water cooling system for industry, reducing the thermal stress on sensitive components and enhancing the reliability and lifespan of server hardware.
5G Base Stations
Active Antenna Units (AAU) in 5G base stations have strict requirements for weight and volume, while also generating significant heat during operation. Liquid cold plates provide a compact and efficient solution for high-power thermal management.
High-performance heat sinks, including aluminum Heat Sinks, copper heat sinks, extruded heat sinks, and water cooled heat sinks, are integrated with water heat sinks, heat sink water, or heat sink with water cooling designs to support AAU modules. Advanced heat sink fin design, skived fin heat sinks, finned heat sinks, and plate fin heat sinks maximize heat dissipation efficiency while maintaining a compact form factor.
Liquid cooled heat sinks, heat sink cold plates, and heat sink with heat pipe solutions are applied to critical components to manage high-density heat, while laser heat sinks, pipe heat sinks, and copper pipe heat sinks address localized hotspots in power electronics.
Comprehensive Thermal Management Solutions
For modern data centers and telecommunication infrastructure, hybrid solutions combining liquid cold plates and heat sinks provide unparalleled performance. Our offerings include:
Liquid Cold Plates: FSW Liquid Cold Plate, Tube Liquid Cold Plate, Brazed Liquid Cold Plate, CPU Water Block, water cooled cold plate, small cold plate, standard cold plates
Heat Sinks: Aluminum heat sink, copper heat sink, extruded heat sink, large heat sink, liquid cooled heat sink, heat sink with water cooling, heat sink with heat pipe, flexible heat sink, skived fin heat sink, plate fin heat sink, water heat sink, laser heat sink
These solutions are designed with advanced cold plate design, cold plate electronics cooling, heat sink design software, and heat sink thermal analysis tools. Heat sink thermal resistance, heat sink fin efficiency, and heat sink performance are optimized to ensure high efficiency in dense server racks, AAUs, and telecom electronics.
Water cooled electronics, water cooling system for industry, and water cooling circuits are integrated to deliver consistent temperature control and superior heat removal in all high-power modules. Heat sink types and design are tailored to application needs, including inverter heat sinks, PC heat sinks, and electronic heat sinks for industrial equipment.
Benefits of Liquid Cold Plates and Heat Sinks
High thermal efficiency – Direct chip-level cooling with water cooled cold plates removes heat rapidly, while heat sinks dissipate residual heat effectively.
Compact and flexible design – Solutions such as tube cold plates, small cold plates, and flexible heat sinks adapt to tight server and telecom environments.
Extended component lifespan – Maintaining optimal temperatures reduces thermal stress on CPUs, GPUs, AAU modules, and power electronics.
Hybrid cooling solutions – Combining liquid cold plates with heat sinks enhances overall system reliability and allows operation under extreme computational or environmental loads.
The Data Center and Telecommunication industry relies on advanced thermal management to support AI computing, high-density servers, and 5G infrastructure. Liquid cold plates and heat sinks—including FSW Liquid Cold Plates, Tube Liquid Cold Plates, Brazed Liquid Cold Plates, aluminum and copper heat sinks, and water cooled heat sinks—offer precise, efficient, and reliable cooling solutions.
By integrating water cooling technology, water cooling circuits, cold plate cooling, and optimized heat sink designs, modern data centers and telecom equipment achieve higher performance, safety, and longevity, ensuring continuous operation even under the most demanding conditions.
