Copper FSW Liquid Cold Plate is a high-performance liquid cooling solution manufactured by combining high thermal conductivity copper materials with advanced Friction Stir Welding (FSW) technology. Designed for demanding thermal management applications, this cold plate efficiently transfers heat from high-power electronic components to circulating coolant, maintaining stable operating temperatures and improving system reliability.
Compared with traditional aluminum cold plates, copper liquid cold plates provide superior thermal conductivity and faster heat spreading, making them ideal for applications requiring high heat flux management, such as power electronics, EV battery systems, IGBT modules, semiconductor equipment, aerospace systems, and advanced computing platforms.
As a professional custom liquid cold plate manufacturer, we provide customized Copper FSW Liquid Cold Plate solutions with optimized cooling channel designs, precision manufacturing, and reliable leak-proof performance.
A Copper FSW Liquid Cold Plate is a type of liquid cold plate that uses copper as the primary heat transfer material and is manufactured through friction stir welding technology.
The cold plate typically consists of:
Copper base plate
Copper cover plate
Internal coolant channels
Liquid inlet and outlet ports
FSW welded sealing structure
During operation, coolant flows through the internal channels and absorbs heat transferred from electronic components. The heated coolant then flows to a radiator or heat exchanger, where the heat is released.
The combination of copper material and FSW manufacturing provides:
High thermal conductivity
Excellent mechanical strength
Reliable sealing performance
Long-term operational stability
The working principle of a copper liquid cold plate is based on liquid heat transfer and forced convection.
High-power components generate heat during operation, including:
IGBT modules
Power semiconductor devices
CPU/GPU processors
EV battery cells
Laser systems
The heat transfers through a thermal interface material (TIM), such as:
Thermal grease
Thermal pads
Phase change materials
to the copper cold plate surface.
Copper has a thermal conductivity of approximately 400 W/m·K, significantly higher than aluminum.
This allows the cold plate to:
Quickly absorb heat
Reduce thermal gradients
Minimize hot spots
Improve temperature uniformity
The coolant flows through precision-designed channels inside the cold plate.
Common cooling fluids include:
Deionized water
Water-glycol mixture
Ethylene glycol coolant
Dielectric coolant
The heat transfer process depends on:
Coolant flow rate
Channel geometry
Reynolds number
Pressure drop
Coolant thermal properties
After absorbing heat, the coolant carries thermal energy away from the copper cold plate and transfers it to a heat exchanger.
The cooled liquid returns to the cold plate, creating a continuous closed-loop cooling system.
Friction Stir Welding (FSW) is an advanced solid-state joining process that uses frictional heat and mechanical stirring to bond materials without melting them.
Unlike conventional welding methods, FSW avoids:
Welding porosity
Thermal cracking
Excessive deformation
Weak heat-affected zones
For Copper FSW Liquid Cold Plates, FSW technology provides:
The solid-state weld creates strong metallurgical bonding between copper plates.
Benefits:
High-pressure resistance
Excellent fatigue performance
Long service life
FSW creates a continuous welded structure around the cooling channels.
Advantages:
Reduced leakage risk
Stable coolant circulation
Suitable for high-pressure cooling systems
Because the material does not melt during welding:
Dimensional accuracy is improved
Flatness is maintained
Thermal stress is reduced
This is critical for applications requiring direct contact with electronic modules.
Copper provides excellent heat transfer capability.
Compared with aluminum cold plates:
| Material | Thermal Conductivity |
|---|---|
| Copper | Approx. 400 W/m·K |
| Aluminum 6061 | Approx. 167 W/m·K |
Copper is especially suitable for high heat flux applications where rapid heat removal is required.
The internal cooling channels can be customized according to thermal requirements.
Common channel designs include:
Serpentine channels
Parallel channels
Microchannel structures
Multi-pass flow channels
Optimized channel design improves:
Coolant distribution
Heat transfer coefficient
Pressure drop control
Copper FSW cold plates provide high cooling performance while maintaining a compact structure.
They are suitable for:
Space-limited electronic systems
High-power density devices
Integrated cooling assemblies
Copper provides:
Good corrosion resistance
High mechanical strength
Long-term thermal stability
Combined with FSW technology, the cold plate can operate reliably under demanding conditions.
| Parameter | Specification |
|---|---|
| Product Name | Copper FSW Liquid Cold Plate |
| Material | Pure Copper / Copper Alloy |
| Manufacturing Process | Friction Stir Welding (FSW) |
| Cooling Type | Liquid Cooling |
| Thermal Conductivity | Approx. 400 W/m·K |
| Coolant | Water, Glycol, Dielectric Fluid |
| Channel Type | Serpentine / Parallel / Custom Design |
| Working Pressure | Customizable according to requirement |
| Heat Dissipation Capacity | Hundreds to Thousands of Watts |
| Surface Treatment | Anti-oxidation / Nickel Plating Optional |
| Size | Customized |
| Service | OEM / ODM Custom Manufacturing |
Copper FSW liquid cold plates are widely used for:
IGBT cooling
MOSFET cooling
Power converters
Inverters
They help maintain semiconductor junction temperatures within safe operating limits.
Electric vehicle battery systems require precise temperature control.
Copper liquid cold plates provide:
Uniform cooling
Fast heat removal
Improved battery safety
Extended battery lifespan
For high-performance computing systems:
AI servers
Data centers
HPC systems
Copper cold plates efficiently manage high thermal loads generated by processors.
Aerospace systems require lightweight and reliable cooling solutions.
Copper FSW cold plates provide:
High cooling efficiency
Compact design
High reliability
Used in:
Solar inverters
Energy storage systems
Power conversion equipment
to maintain stable operating temperatures.
| Feature | Copper FSW Liquid Cold Plate | Aluminum Liquid Cold Plate |
|---|---|---|
| Thermal Conductivity | Higher (~400 W/m·K) | Lower (~167 W/m·K) |
| Heat Spreading | Excellent | Good |
| Weight | Higher | Lower |
| Cost | Higher | More economical |
| Application | High-power cooling | General thermal management |
Copper is preferred for applications where maximum thermal performance is more important than weight and cost.
As an experienced liquid cold plate manufacturer, we provide customized thermal management solutions for global customers.
Our capabilities include:
Copper cold plate design
Cooling channel optimization
Thermal simulation analysis
Friction stir welding production
Leak testing
Performance validation
We can customize:
Cold plate dimensions
Channel layout
Coolant type
Heat load requirements
Interface structure
to meet specific application requirements.
A Copper FSW Liquid Cold Plate is a high-performance cooling plate made from copper and manufactured using friction stir welding technology to create internal coolant channels for efficient heat removal.
Copper has higher thermal conductivity, allowing faster heat transfer and better performance in high-power thermal management applications.
FSW provides strong joints, low deformation, excellent sealing, and improved reliability compared with traditional welding methods.
The cooling capacity depends on size, coolant flow rate, channel design, and operating conditions. Customized designs can handle hundreds to thousands of watts of heat load.
Yes. Dimensions, cooling channels, ports, materials, and thermal performance can be customized according to customer requirements.
Kingka Tech Industrial Limited
We specialize in Heat Sink、Liquid Cold Plate、precision CNC machining and our products are widely used in telecommunication industry, aerospace, automotive, industrial control, power electronics, medical instruments, security electronics, LED lighting and multimedia consumption.
Address:
Da Long New Village, Xie Gang Town, Dongguan City, Guangdong Province, China 523598
Email:
Tel:
+86 137 1244 4018
