Bonded Fin Heat Sink Parts

KAINGKA Tech Industrial Limited offers precision-engineered Bonded Fin Heat Sink Parts tailored for high-power thermal management applications. Designed to deliver superior airflow and heat dissipation, our bonded aluminum heat sinks are ideal for IGBT modules, inverters, EV chargers, and power conversion systems where space is limited but thermal efficiency is critical.

What Are Bonded Fin Heat Sink Parts?

Bonded fin heat sinks consist of a base (usually aluminum or copper) onto which individual fins are mechanically or thermally bonded. Unlike extruded heat sinks, bonded fin structures allow for taller, thinner fins and tighter spacing, achieving a higher surface area for forced-air cooling and enhanced thermal performance.

Features of Bonded Fin Heat Sink Parts

• High thermal conductivity using aluminum 6063/6061 or copper base

• Customizable fin geometry: height, pitch, thickness, and layout

• Compact & lightweight design ideal for dense assemblies

• Superior forced air cooling performance

• Strong mechanical bond ensures durability

• Compatible with CNC machining and surface treatments

• Supports thermal interface materials (TIMs) for optimal contact

Applications of Bonded Fin Heat Sinks

KAINGKA’s bonded fin heat sink parts are widely used in:

• Power electronic modules (IGBTs, MOSFETs, SiC)

• EV inverters and charging systems

• Solar inverters and battery energy storage systems

• High-frequency telecom equipment

• Medical and industrial automation devices

These heat sinks are optimized for airflow direction, low-pressure drop, and high-power dissipation in space-constrained environments.

Advantages of KAINGKA Tech’s Bonded Fin Heat Sink

• Custom aluminum or copper base for different conductivity needs

• Advanced bonding process (thermal epoxy, soldering, or brazing)

• Supports complex geometries and mixed-material assemblies

• Small to large batch production supported

• Optional surface treatment: anodizing, nickel plating, etc.

• Strict quality control: 3D measurement, thermal analysis, bonding inspection

Why Choose KAINGKA Tech?

With over 15 years of experience in thermal management parts, KAINGKA Tech Industrial Limited offers:

• In-house design and mold development

• Full support for OEM/ODM customization

• Fast prototyping and bulk production

• ISO-certified quality systems

• Global shipping with technical support

Customization Options

FAQ – Bonded Fin Heat Sink Parts

Q1: What is the main difference between bonded fin and extruded heat sinks?
A: Bonded fin heat sinks offer more flexible designs, higher fin density, and better performance for forced-air applications. Extruded ones are limited by tooling and fin geometry.

Q2: Can you design based on our power and airflow requirements?
A: Yes. Our engineers use simulation tools (CFD, thermal modeling) to design the ideal fin structure and base size for your specific thermal needs.

Q3: Do you offer bonded heat sinks with copper bases?
A: Absolutely. Copper bases are available for high heat load applications to improve heat spreading.

Q4: What's the typical lead time for custom parts?

A: Prototypes in 7–15 days, bulk orders typically 20–30 days depending on complexity and quantity.

Q5: What is the bonding strength and thermal resistance like?
A: Bonding is tested to meet mechanical reliability standards. We use thermal interface materials and bonding processes with low thermal resistance.